JPS6339937U - - Google Patents
Info
- Publication number
- JPS6339937U JPS6339937U JP13282086U JP13282086U JPS6339937U JP S6339937 U JPS6339937 U JP S6339937U JP 13282086 U JP13282086 U JP 13282086U JP 13282086 U JP13282086 U JP 13282086U JP S6339937 U JPS6339937 U JP S6339937U
- Authority
- JP
- Japan
- Prior art keywords
- guide plate
- lead frame
- heated
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 239000003566 sealing material Substances 0.000 claims 1
- 230000004927 fusion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13282086U JPS6339937U (en]) | 1986-08-29 | 1986-08-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13282086U JPS6339937U (en]) | 1986-08-29 | 1986-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6339937U true JPS6339937U (en]) | 1988-03-15 |
Family
ID=31032559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13282086U Pending JPS6339937U (en]) | 1986-08-29 | 1986-08-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6339937U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023530706A (ja) * | 2020-06-18 | 2023-07-19 | クリック アンド ソッファ インダストリーズ、インク． | ダイアタッチシステム、フリップチップボンディングシステム、クリップアタッチシステムなどの装置のためのオーブンおよびその関連方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5029793A (en]) * | 1973-07-21 | 1975-03-25 |
-
1986
- 1986-08-29 JP JP13282086U patent/JPS6339937U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5029793A (en]) * | 1973-07-21 | 1975-03-25 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023530706A (ja) * | 2020-06-18 | 2023-07-19 | クリック アンド ソッファ インダストリーズ、インク． | ダイアタッチシステム、フリップチップボンディングシステム、クリップアタッチシステムなどの装置のためのオーブンおよびその関連方法 |